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IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY

IEEE T DEVICE MAT RE

ISSN:1530-4388 E-ISSN:—  出版商:Institute of Electrical and Electronics Engineers Inc  国家:UNITED STATES  周期:Quarterly

影响因子(2024)
2.300
中科院分区(2025 官方末版)
3 区
JCR 分区
Q3
审稿周期
约9 周
录用比例
暂无
收录情况  h-index:63  CiteScore:3.50
投稿入口: 投稿系统  期刊官网 

期刊简介

The scope of the publication includes| but is not limited to Reliability of: Devices| Materials| Processes| Interfaces| Integrated Microsystems (including MEMS & Sensors)| Transistors| Technology (CMOS| BiCMOS| etc.)| Integrated Circuits (IC| SSI| MSI| LSI| ULSI| ELSI| etc.)| Thin Film Transistor Applications. The measurement and understanding of the reliability of such entities at each phase| from the concept stage through research and development and into manufacturing scale-up| provides the overall database on the reliability of the devices| materials| processes| package and other necessities for the successful introduction of a product to market. This reliability database is the foundation for a quality product| which meets customer expectation. A product so developed has high reliability. High quality will be achieved because product weaknesses will have been found (root cause analysis) and designed out of the final product. This process of ever increasing reliability and quality will result in a superior product. In the end| reliability and quality are not one thing; but in a sense everything| which can be or has to be done to guarantee that the product successfully performs in the field under customer conditions. Our goal is to capture these advances. An additional objective is to focus cross fertilized communication in the state of the art of reliability of electronic materials and devices and provide fundamental understanding of basic phenomena that affect reliability. In addition| the publication is a forum for interdisciplinary studies on reliability. An overall goal is to provide leading edge/state of the art information| which is critically relevant to the creation of reliable products.

投稿经验(1 条,综合评分 7.00000/10)

cheese1996  评分:7.0/10  已投结果未知  2023-05-11 19:51:22.0
投稿经验:2023.5.8投稿,under review 希望有好运 其他用户回复:
helimpopo  已投修改后录用  2019-04-22 10:33:43.0
投稿经验:2019.1.8投稿2019.3.3反馈大修2019.3.26提交修改版2019.4.19反馈直接接受,要求上传最终版2019.4.20上传完最终版2019.4.21反馈进行版权转移操作2019.4.22完成版权转移大修认真改,甚至连a,the这些也改了标记出来,然后就直接接收了。有个自愿的110美元每页的费用,说是让期刊变得更好。我没交。 其他用户回复:【Saxonlli】 发表时间:2023-07-16 23:25:28 0 人赞主页 好友自愿捐款绷不住啦
wangb2009  不详  2011-08-19 14:52:00.0
投稿经验:期刊主页网址: http://ieeexplore.ieee.org/xpl/recentissue.jsp?punumber=7298
其他用户回复:
viptju  不详  2011-07-12 14:26:00.0
投稿经验:第一次投该刊。等待中。 其他用户回复:

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