J ELECTRON PACKAGING
ISSN：1043-7398 E-ISSN：1528-9044 出版商：American Society of Mechanical Engineers(ASME) 国家：UNITED STATES 周期：Quarterly
| 收录情况 | h-index：46 CiteScore：3.30 |
The Journal of Electronic Packaging publishes papers that use experimental and theoretical (analytical and computer-aided) methods| approaches| and techniques to address and solve various mechanical| materials| and reliability problems encountered in the analysis| design| manufacturing| testing| and operation of electronic and photonics components| devices| and systems. Scope: Microsystems packaging; Systems integration; Flexible electronics; Materials with nano structures and in general small scale systems.
数据整理自公开网络的投稿反馈，仅供参考。
