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  2. 英文期刊ENGINEERING, ELECTRICAL & ELECTRONIC

MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING

MAT SCI SEMICON PROC

ISSN:1369-8001 E-ISSN:—  出版商:Elsevier  国家:ENGLAND  周期:Bimonthly来源El

影响因子(2024)
4.600
中科院分区(2025 官方末版)
3 区
JCR 分区
Q2
审稿周期
约7 周
录用比例
88.33%
收录情况  h-index:49  CiteScore:5.90
投稿入口: 投稿系统  期刊官网 

期刊简介

Materials Science in Semiconductor Processing provides a unique forum for the discussion of novel processing| applications and theoretical studies of functional materials and devices for (opto)electronics| sensors| detectors| biotechnology and green energy. Each issue will aim to provide a snapshot of current insights| new achievements| breakthroughs and future trends in such diverse fields as microelectronics| energy conversion and storage| communications| biotechnology| (photo)catalysis| nano- and thin-film technology| hybrid and composite materials| chemical processing| vapor-phase deposition| device fabrication| and modelling| which are the backbone of advanced semiconductor processing and applications. Coverage will include: advanced lithography for submicron devices; etching and related topics; ion implantation; damage evolution and related issues; plasma and thermal CVD; rapid thermal processing; advanced metallization and interconnect schemes; thin dielectric layers| oxidation; sol-gel processing; chemical bath and (electro)chemical deposition; compound semiconductor processing; new non-oxide materials and their applications; (macro)molecular and hybrid materials; molecular dynamics| ab-initio methods| Monte Carlo| etc.; new materials and processes for discrete and integrated circuits; magnetic materials and spintronics; heterostructures and quantum devices; engineering of the electrical and optical properties of semiconductors; crystal growth mechanisms; reliability| defect density| intrinsic impurities and defects.

投稿经验(0 条,)

趣_多_多  2018-05-20 16:09:00.0
2017.12.19 投稿 2018.02.05 审稿意见返回(大修) 2018.03.30 稿件修回 2018.05.17 二审意见返回(小修) 2018.05.17 稿件修回 2018.05.19 接收 文章是有关光电催化材料的制备和应用的。编辑处理稿件的速度很快,不会长时间拿在手里不放。一审用了1个月多一点,时间也不长。一审意见返回后给了近两个月的修改时间。修回后又under review 1个多月,然后审稿人给了3个语法表达方面的小修意见,当天修回后两天后接收。 对期刊编辑处理稿件的速度感到十分满意,感谢主编Steven M. Durbin 和编辑A. Hernández Ramírez!
BOting  2017-09-12 10:47:00.0
7.12投稿with editor 7.13under review 8.15Revise-暑假8.28开学补数据 9.8 修回 9.11 Accept 很快了,开心
liming1989  2015-12-30 09:18:00.0
工程与材料 无机非金属材料 无机非金属类光电信息与功能材料 约1个月 已投修改后录用
wuhongjing  2015-07-08 21:09:00.0
编辑处理速度很快,非常赞,值得投稿。
日生星星  2015-06-23 20:50:00.0
2月1号投稿,经历一次大修和小修,6月11号接受,速度很快,编辑很负责,也挺容易中的
fjlth  2015-06-22 17:13:00.0
2014 影响因子:1.955.涨了
fjlth  2015-05-09 22:03:00.0
3月27号投稿,4月9号一审回来,只要一个审稿人意见,要补充一下实验,也不是太多意见,编辑给了拒稿重投。4月21号修改后重投,5月9号接受,换了一个审稿人。速度已经算相当快了。
一般啦  2015-03-18 09:13:00.0
under review两天后时间变了下,这是几个意思呀

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