MICROELECTRON INT
ISSN：1356-5362 E-ISSN：— 出版商：Emerald Publishing 国家：ENGLAND 周期：Tri-annual
| 收录情况 | h-index：19 CiteScore：1.60 |
Microelectronics International provides an authoritative| international and independent forum for the critical evaluation and dissemination of research and development| applications| processes and current practices relating to advanced packaging| micro-circuit engineering| interconnection| semiconductor technology and systems engineering. It represents a current| comprehensive and practical information tool. The Editor| Dr John Atkinson| welcomes contributions to the journal including technical papers| research papers| case studies and review papers for publication. Please view the Author Guidelines for further details. Microelectronics International comprises a multi-disciplinary study of the key technologies and related issues associated with the design| manufacture| assembly and various applications of miniaturized electronic devices and advanced packages. Among the broad range of topics covered are: • Advanced packaging • Ceramics • Chip attachment • Chip on board (COB) • Chip scale packaging • Flexible substrates • MEMS • Micro-circuit technology • Microelectronic materials • Multichip modules (MCMs) • Organic/polymer electronics • Printed electronics • Semiconductor technology • Solid state sensors • Thermal management • Thick/thin film technology • Wafer scale processing.
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