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SOLDERING & SURFACE MOUNT TECHNOLOGY

SOLDER SURF MT TECH

ISSN:0954-0911 E-ISSN:—  出版商:Emerald Publishing  国家:ENGLAND  周期:Quarterly

影响因子(2024)
1.800
中科院分区(2025 官方末版)
4 区
JCR 分区
Q2
审稿周期
约12 周
录用比例
暂无
收录情况  h-index:28  CiteScore:3.80
投稿入口: 期刊官网 

期刊简介

Soldering & Surface Mount Technology seeks to make an important contribution to the advancement of research and application within the technical body of knowledge and expertise in this vital area. Soldering & Surface Mount Technology compliments its sister publications; Circuit World and Microelectronics International. The journal covers all aspects of SMT from alloys| pastes and fluxes| to reliability and environmental effects| and is currently providing an important dissemination route for new knowledge on lead-free solders and processes. The journal comprises a multidisciplinary study of the key materials and technologies used to assemble state of the art functional electronic devices. The key focus is on assembling devices and interconnecting components via soldering| whilst also embracing a broad range of related approaches.

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